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Publication date Communities Collections Article title Author(s) Journal/Conference
21 Nov 2022 SERC Institute for Infocomm Research Mixed-Order Relation-Aware Recurrent Neural Networks for Spatio-Temporal Forecasting Yuxuan Liang, Kun Ouyang, Yiwei Wang, Zheyi Pan, Yifang Yin, Hongyang Chen, Junbo Zhang, Yu Zheng, David S. Rosenblum, Roger Zimmermann IEEE Transactions on Knowledge and Data Engineering
1 Aug 2020 SERC Institute for Infocomm Research Two-core photonic crystal fiber with selective liquid infiltration in the central air hole for temperature sensing Chenlu Wang, Perry Ping Shum, Dora Juan Juan Hu, Yu-Cheng Chen, Zhilin Xu, Shuhui Liu, Yanan Zhang, Yongwei Zhu, Yu Zheng, Baocheng Li, Chen Yang, Weijun Tong, Yue Meng, Georges Humbert OSA Continuum
10 Apr 2020 SERC Institute for Infocomm Research Temperature sensor based on selective liquid-filled twin-core photonic crystal fiber Chenlu Wang, Perry Ping Shum, Dora Juan Juan Hu, Zhilin Xu, Shuhui Liu, Yongwei Zhu, Yu Zheng, Baocheng Li, Yang Chen, Weijun Tong, Yue Meng, Georges Humbert SPIE Conference Proceedings
8 Mar 2020 SERC Institute for Infocomm Research Robust Convolutional Neural Network Model for Wavelength Detection in Overlapping Fiber Bragg Grating Sensor Network Baocheng Li, Zhi-Wei Tan, Perry Ping Shum, Dora Juan Juan Hu, Chenlu Wang, Yu Zheng, Shuhui Liu Optical Fiber Communication Conference (OFC) 2020
29 Sep 2019 SERC Institute for Infocomm Research Temperature Sensor Based on Selectively Liquid Infiltrated Dual Core Photonic Crystal Fiber Chenlu Wang, Perry Ping Shum, Dora Juan Juan Hu, Zhilin Xu, Yongwei Zhu, Yiyang Luo, Shuhui Liu, Yu Zheng 2019 IEEE Photonics Conference (IPC)
6 Nov 2018 SERC Singapore Institute of Manufacturing Technology Deep channel fabrication on copper by multi-scan underwater laser machining Wenhe Feng, Jiang Guo, Wenjin Yan, Yin Chi Wan, Hongyu Zheng Optics & Laser Technology
1 Sep 2013 SERC Institute of Microelectronics Antenna-in-Package Design Based on Wafer-Level Packaging With Through Silicon Via Technology Cheng Jin, V.N Sekhar, Xiaoyue Bao, Bangtao Chen, Boyu Zheng, Rui Li IEEE Transactions on Components, Packaging and Manufacturing Technology