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21 Nov 2022
SERC
Institute for Infocomm Research
Mixed-Order Relation-Aware Recurrent Neural Networks for Spatio-Temporal Forecasting
Yuxuan Liang,
Kun Ouyang,
Yiwei Wang,
Zheyi Pan,
Yifang Yin,
Hongyang Chen,
Junbo Zhang,
Yu Zheng,
David S. Rosenblum,
Roger Zimmermann
IEEE Transactions on Knowledge and Data Engineering
1 Aug 2020
SERC
Institute for Infocomm Research
Two-core photonic crystal fiber with selective liquid infiltration in the central air hole for temperature sensing
Chenlu Wang,
Perry Ping Shum,
Dora Juan Juan Hu,
Yu-Cheng Chen,
Zhilin Xu,
Shuhui Liu,
Yanan Zhang,
Yongwei Zhu,
Yu Zheng,
Baocheng Li,
Chen Yang,
Weijun Tong,
Yue Meng,
Georges Humbert
OSA Continuum
10 Apr 2020
SERC
Institute for Infocomm Research
Temperature sensor based on selective liquid-filled twin-core photonic crystal fiber
Chenlu Wang,
Perry Ping Shum,
Dora Juan Juan Hu,
Zhilin Xu,
Shuhui Liu,
Yongwei Zhu,
Yu Zheng,
Baocheng Li,
Yang Chen,
Weijun Tong,
Yue Meng,
Georges Humbert
SPIE Conference Proceedings
8 Mar 2020
SERC
Institute for Infocomm Research
Robust Convolutional Neural Network Model for Wavelength Detection in Overlapping Fiber Bragg Grating Sensor Network
Baocheng Li,
Zhi-Wei Tan,
Perry Ping Shum,
Dora Juan Juan Hu,
Chenlu Wang,
Yu Zheng,
Shuhui Liu
Optical Fiber Communication Conference (OFC) 2020
29 Sep 2019
SERC
Institute for Infocomm Research
Temperature Sensor Based on Selectively Liquid Infiltrated Dual Core Photonic Crystal Fiber
Chenlu Wang,
Perry Ping Shum,
Dora Juan Juan Hu,
Zhilin Xu,
Yongwei Zhu,
Yiyang Luo,
Shuhui Liu,
Yu Zheng
2019 IEEE Photonics Conference (IPC)
6 Nov 2018
SERC
Singapore Institute of Manufacturing Technology
Deep channel fabrication on copper by multi-scan underwater laser machining
Wenhe Feng,
Jiang Guo,
Wenjin Yan,
Yin Chi Wan,
Hongyu Zheng
Optics & Laser Technology
1 Sep 2013
SERC
Institute of Microelectronics
Antenna-in-Package Design Based on Wafer-Level Packaging With Through Silicon Via Technology
Cheng Jin,
V.N Sekhar,
Xiaoyue Bao,
Bangtao Chen,
Boyu Zheng,
Rui Li
IEEE Transactions on Components, Packaging and Manufacturing Technology
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