Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
18 Mar 2024 | SERC | Institute of Microelectronics | Assembly process characterization of 3D Stacking of Heterogeneous Chiplets | Sharon Pei Siang Lim, Boon Long Lau, Tai Chong Chai, Yong Liang Ye | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
18 Mar 2024 | SERC | Institute of Microelectronics | Transient Thermal Characterization and Analysis for Next Generation SiC Power Module | Gongyue Tang, Yong Liang Ye, Leong Ching Wai, Yong Han | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
10 Aug 2021 | SERC | Institute of Microelectronics | Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module | Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |