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5 Jan 2022 SERC Institute of Microelectronics Heating Dissipation Discussion of TSV-integrated Ion Trap with Glass Interposer Peng Zhao, Xin Wen Bi, Hong Yu Li, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)