| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Heating Dissipation Discussion of TSV-integrated Ion Trap with Glass Interposer | Peng Zhao, Xin Wen Bi, Hong Yu Li, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |