| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Sep 2014 | SERC | Institute of Microelectronics | The Role of Ti Capping Layer in HfOX Based RRAM Devices | Zheng Fang, Simon S. Wong, H.-S. Philip Wong, Xin Peng Wang, Joon Sohn, Bao Bin Weng, Zhi Ping Zhang, Zhi Xian Chen, Yan Zhe Tang, Guo-Qiang Lo, J. Provine, Dim-Lee Kwong | IEEE Electron Device Letters |