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Publication date Communities Collections Article title Author(s) Journal/Conference
13 Apr 2020 SERC Institute of Microelectronics A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019 SERC Institute of Microelectronics Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling Yong Han, Boon Long Lau, Gongyue Tang, Haoran Chen, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
1 May 2019 SERC Institute of Microelectronics Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design Gongyue Tang, Tai Chong Chai, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
13 Aug 2018 BMRC Institute of Molecular and Cell Biology S-Nitrosylation of Divalent Metal Transporter 1 Enhances Iron Uptake to Mediate Loss of Dopaminergic Neurons and Motoric Deficit Yee Kit Tai, Chao Liu, Cheng-Wu Zhang, Shun Qiang Lo, Seok Ting Ang, Katherine Chee Meng Chew, Dejie Yu, Bing Han Chai, Bobby Tan, Bryce Wei Quan Tan, Mui Cheng Liang, Hwee Tong Tan, Jia Ying Tang, Mitchell Kim Peng Lai, John Jia En Chua, Maxey Ching Ming Chung, Sanjay Khanna, Kah-Leong Lim, Tuck Wah Soong Journal of Neuroscience
13 Dec 2017 BMRC Institute of Molecular and Cell Biology APP upregulation contributes to retinal ganglion cell degeneration via JNK3 Chao Liu, Cheng-Wu Zhang, Yi Zhou, Wan Qing Wong, Liying Corinne Lee, Wei Yi Ong, Sung Ok Yoon, Wanjin Hong, Xin-Yuan Fu, Tuck Wah Soong, Edward H. Koo, Lawrence W. Stanton, Kah-Leong Lim, Zhi-Cheng Xiao, Gavin S. Dawe Cell Death & Differentiation
21 Mar 2017 SERC Institute of Microelectronics Water-Resonator-Based Metasurface: An Ultrabroadband and Near-Unity Absorption Qinghua Song, Wu Zhang, Pin Chieh Wu, Weiming Zhu, Zhong Xiang Shen, Peter Han Joo Chong, Qing Xuan Liang, Zhen Chuan Yang, Yi Long Hao, Hong Cai, Hai Feng Zhou, Yuandong Gu, Guo-Qiang Lo, Din Ping Tsai, Tarik Bourouina, Yamin Leprince-Wang, Ai-Qun Liu Advanced Optical Materials
3 Feb 2017 SERC Institute of Microelectronics High-Density 3D-Boron Nitride and 3D Graphene for High-Performance Nano-Thermal Interface Material Manuela Loeblein, Siu Hon Tsang, Matthieu Pawlik, Eric Jian Rong Phua, Han Yong, Xiao Wu Zhang, Chee Lip Gan, Edwin Hang Tong Teo ACS Nano
1 Jan 2017 SERC Institute of Microelectronics Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology
7 Apr 2016 SERC Institute of Microelectronics Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices Gongyue Tang, Boon Long Lau, Xiaowu Zhang, Daniel Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology
18 Jan 2016 SERC Institute of Microelectronics Design Optimization and Characterization of Silicon Microcooler System through Finite Element Modeling and Experimental Analyses Fa Xing Che, Yong Han, Boon Long Lau, Xiaowu Zhang IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
8 Dec 2015 SERC Institute of Microelectronics Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang Components, Packaging and Manufacturing Technology, IEEE Transactions on
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews
9 Jun 2015 SERC Institute of Microelectronics Heat Dissipation Capability of a Package-On-Package Embedded Wafer-Level Package Yong Han, Boon Long Lau, Yang Jung, Xiaowu Zhang Design & Test, IEEE
17 Dec 2014 SERC Institute of Microelectronics Characterization and Modeling of Fine-Pitch Copper Ball 4 Bonding on a Cu/Low-k Chip Xiaowu Zhang, T. C. Chai, Fa Xing Che, L. C. Wai Journal of Electronic Materials
23 Oct 2014 BMRC Institute of Molecular and Cell Biology Sorting Nexin 27 Regulates Aβ Production through Modulating γ-Secretase Activity Xin Wang, Timothy Huang, Yingjun Zhao, Qiuyang Zheng, Robert C. Thompson, Guojun Bu, Yun-wu Zhang, Wanjin Hong, Huaxi Xu Cell Reports
1 Aug 2014 SERC Institute of Microelectronics Investigation on Reliability of Embedded Ultrathin Sensor Chip in Organic Substrate Under Drop Impact Loading by Stresses Monitor and FEM Simulation Zhaohui Chen, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
22 Jul 2014 SERC Institute of Microelectronics Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices Yong Han, Boon Long Lau, Xiaowu Zhang, Yoke Choy Leong, Kok Fah Choo IEEE Transactions on Components, Packaging and Manufacturing Technology
16 Apr 2014 SERC Institute of Microelectronics Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device Yong Han, Boon Long Lau, Xiaowu Zhang, Yoke Choy Leong, Kok Fah Choo IEEE Transactions on Components, Packaging and Manufacturing Technology
31 Mar 2014 SERC Institute of Microelectronics Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers Heng Yun Zhang, Xiao Wu Zhang, B. L. Lau, Sharon Lim, Liang Ding, M. B. Yu IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Nov 2013 SERC Institute of Microelectronics Trapezoidal Microchannel Heat Sink With Pressure-Driven and Electro-Osmotic Flows for Microelectronic Cooling Yong Han, Yong Jiun Lee, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Oct 2013 SERC Institute of Microelectronics Investigation on Die Shift Issues in the 12-in Wafer-Level Compression Molding Process Lin Bu, Siowling Ho, Sorono Dexter Velez, Taichong Chai, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology