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28 Feb 2024
SERC
Institute of Microelectronics
Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink
Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong,
Keng Yuen Jason Au,
Jun Wei Javier Ong,
King Jien Chui,
Jun LI,
Hongying Li,
Duc Vinh Le,
Jing Lou
IEEE Transactions on Components, Packaging and Manufacturing Technology
30 Oct 2023
SERC
Institute of Microelectronics
Hybrid outflow boundary condition for the pseudopotential LBM simulation of flow boiling
(Pending publish)
Jun LI,
Duc-Vinh Le,
Hongying Li,
Xiaowu Zhang,
Chang-Wei Kang,
Jing Lou
International Journal of Thermal Sciences
3 Aug 2023
SERC
Institute of Microelectronics
Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs
Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong,
Keng Yuen Jason Au,
King Jien Chui,
Jing Lou,
Hongying Li,
Duc Vinh Le
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022
SERC
Institute of Microelectronics
Nonlinear Thermal Stress/Strain Analyses of Through SiC Via
C.L. Alan Lee,
Xiaowu Zhang,
Haoran Chen
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module
Gongyue Tang,
Leong Ching Wai,
Siak Boon Lim,
Yong Liang Ye,
Boon Long Lau,
Kazunori Yamamoto,
Xiaowu Zhang
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP)
Xiaowu Zhang,
Boon Long Lau,
Yong Han,
Haoran Chen,
Ming Chinq Jong,
Sharon Pei Siang Lim,
Simon Siak Boon Lim,
Xiaobai Wang,
Yosephine Andriani,
Songlin Liu
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Oct 2020
SERC
Institute of Materials Research and Engineering
Lignin-Incorporated Nanogel Serving As an Antioxidant Biomaterial for Wound Healing
Jia Xu,
Jia Jia Xu,
Qianyu Lin,
Lu Jiang,
Duoteng Zhang,
Zibiao Li,
Bo Ma,
Chengwu Zhang,
Lin Li,
Dan Kai,
Hai-Dong Yu,
Xian Jun Loh
ACS Applied Bio Materials
13 Apr 2020
SERC
Institute of Microelectronics
A Dynamic Control System for Server Processor Direct Liquid Cooling
Haoran Chen,
Yong Han,
Gongyue Tang,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019
SERC
Institute of Microelectronics
Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling
Yong Han,
Boon Long Lau,
Gongyue Tang,
Haoran Chen,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
1 May 2019
SERC
Institute of Microelectronics
Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design
Gongyue Tang,
Tai Chong Chai,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
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