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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Nonlinear Thermal Stress/Strain Analyses of Through SiC Via C.L. Alan Lee, Xiaowu Zhang, Haoran Chen 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Oct 2020 SERC Institute of Materials Research and Engineering Lignin-Incorporated Nanogel Serving As an Antioxidant Biomaterial for Wound Healing Jia Xu, Jia Jia Xu, Qianyu Lin, Lu Jiang, Duoteng Zhang, Zibiao Li, Bo Ma, Chengwu Zhang, Lin Li, Dan Kai, Hai-Dong Yu, Xian Jun Loh ACS Applied Bio Materials
13 Apr 2020 SERC Institute of Microelectronics A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019 SERC Institute of Microelectronics Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling Yong Han, Boon Long Lau, Gongyue Tang, Haoran Chen, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
1 May 2019 SERC Institute of Microelectronics Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design Gongyue Tang, Tai Chong Chai, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
13 Aug 2018 BMRC Institute of Molecular and Cell Biology S-Nitrosylation of Divalent Metal Transporter 1 Enhances Iron Uptake to Mediate Loss of Dopaminergic Neurons and Motoric Deficit Yee Kit Tai, Chao Liu, Cheng-Wu Zhang, Shun Qiang Lo, Seok Ting Ang, Katherine Chee Meng Chew, Dejie Yu, Bing Han Chai, Bobby Tan, Bryce Wei Quan Tan, Mui Cheng Liang, Hwee Tong Tan, Jia Ying Tang, Mitchell Kim Peng Lai, John Jia En Chua, Maxey Ching Ming Chung, Sanjay Khanna, Kah-Leong Lim, Tuck Wah Soong Journal of Neuroscience
13 Dec 2017 BMRC Institute of Molecular and Cell Biology APP upregulation contributes to retinal ganglion cell degeneration via JNK3 Chao Liu, Cheng-Wu Zhang, Yi Zhou, Wan Qing Wong, Liying Corinne Lee, Wei Yi Ong, Sung Ok Yoon, Wanjin Hong, Xin-Yuan Fu, Tuck Wah Soong, Edward H. Koo, Lawrence W. Stanton, Kah-Leong Lim, Zhi-Cheng Xiao, Gavin S. Dawe Cell Death & Differentiation
21 Mar 2017 SERC Institute of Microelectronics Water-Resonator-Based Metasurface: An Ultrabroadband and Near-Unity Absorption Qinghua Song, Wu Zhang, Pin Chieh Wu, Weiming Zhu, Zhong Xiang Shen, Peter Han Joo Chong, Qing Xuan Liang, Zhen Chuan Yang, Yi Long Hao, Hong Cai, Hai Feng Zhou, Yuandong Gu, Guo-Qiang Lo, Din Ping Tsai, Tarik Bourouina, Yamin Leprince-Wang, Ai-Qun Liu Advanced Optical Materials