| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Low Temperature Oxide Passivation for Via-last/backside process | Serine Soh Siew Boon, Soon Wee Ho, Wang Zong Bin, Chia Ching Keat | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |