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Publication date Communities Collections Article title Author(s) Journal/Conference
10 Aug 2021 SERC Institute of Microelectronics Dielectric Materials Characterization for Hybrid Bonding Vivek Chidambaram, Prayudi Lianto, Xiangyu Wang, Gilbert See, Nicholas Wiswell, Masaya Kawano 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications Sharon Pei Siang Lim, Ser Choong Chong, Vivek Chidambaram 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
19 Jul 2019 SERC Institute of Microelectronics Hermetic Sealant Material Possibilities for IR Sensor Packaging Vivek Chidambaram, Lin Bu, Kai Liang Chuan Journal of Electronic Materials
1 Sep 2018 SERC Institute of Microelectronics Cost-Effective Testing Solutions for Sealing Material with IR Package Bu Lin, Jason Keng Yuen Au, Mian Zhi Ding, Vivek Chidambaram, Foo Wing Ng IEEE Transactions on Components, Packaging and Manufacturing Technology
30 May 2017 SERC Institute of Microelectronics High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors Jinghui Xu, Zhipeng Ding, Vivek Chidambaram, Hongmiao Ji, Yuandong Gu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Mar 2015 SERC Institute of Microelectronics Al-Ge Diffusion Bonding for Hermetic Sealing Application Vivek Chidambaram, Wickramanayaka Sunil Journal of Electronic Materials
8 Apr 2014 SERC Institute of Microelectronics Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application Vivek Chidambaram, Chen Bangtao, Gan Chee Lip, Daniel Rhee Min Woo Journal of Electronic Materials