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Publication date Communities Collections Article title Author(s) Journal/Conference
3 Aug 2023 SERC Institute for Infocomm Research 3D Defect Detection and Metrology of HBMs using Semi-Supervised Deep Learning Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Zhao Ziyuan, Cai Lile, Xu Xun, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
12 Jul 2022 SERC Institute for Infocomm Research Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Xu Xun, Oo Zaw Min, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans Ramanpreet Singh Pahwa, Saisubramaniam Gopalakrishnan, Huang Su, Ong Ee Ping, Haiwen Dai, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning Ramanpreet Singh Pahwa, Ma Tin Lay Nwe, Richard Chang, Oo Zaw Min, Wang Jie, Saisubramaniam Gopalakrishnan, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao, Haiwen Dai, Jens Timo Neumann, Ramani Pichumani, Tom Gregorich 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Dec 2020 SERC Institute for Infocomm Research MACHINE-LEARNING BASED METHODOLOGIES FOR 3D X-RAY MEASUREMENT, CHARACTERIZATION AND OPTIMIZATION FOR BURIED STRUCTURES IN ADVANCED IC PACKAGES Ramanpreet Singh Pahwa, Tin Lay Nwe, Richard Chang, Zaw Min, Wang Jie, Tom Gregorich, David Ho, Vempati Srinivasa Rao International Wafer Level Packaging Conference (IWLPC)
30 May 2017 SERC Institute of Microelectronics Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package Zhaohui Chen, Faxing Che, Mian Zhi Ding, David Soon Wee Ho, Tai Chong Chai, Vempati Srinivasa 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package Sharon PS Lim, Daniel Ismael, Ye Yong Liang, Vempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Aug 2015 SERC Institute of Microelectronics Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya IEEE Design & Test
1 Aug 2013 SERC Institute of Microelectronics Development of Package-on-Package Using Embedded Wafer-Level Package Approach (Pending publish) Ser Choong Chong, David Ho Soon Wee, Vempati Srinivasa Rao, Nagendra Sekhar Vasarla IEEE Transactions on Components, Packaging and Manufacturing Technology