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23 Jun 2020 BMRC Singapore Immunology Network Combinatorial single-cell analyses of granulocyte-monocyte progenitor heterogeneity reveals an early uni-potent neutrophil progenitor Immanuel Kwok, Etienne Becht, Yu Xia, Melissa Ng, Ye Chean Teh, Leonard De Li Tan, Maximilien Evrard, Jackson L.Y Li, Hoa Tran TN, Yingrou Tan, Dehua Liu, Kahang Liong, Keith Leong, Yuning Zhang, Andre Olsson, Chinmay Kumar Mantri, Pavithra Shyamsunder, Zhaoyuan Liu, Cecile Piot, Charles-Antoine Dutertre, Hui Cheng, Sudipto Bari, Nicholas Ang, Subhra K. Biswas, H. Philip Koeffler, Hong Liang Tey, Anis Larbi, I-Hsin Su, Bernett Lee, Ashley St. John, Jerry K.Y. Chan, William Y.K. Hwang, Jinmiao Chen, Nathan Salomonis, Shu Zhen Chong, H. Leighton Grimes, Bing Liu, Andrés Hidalgo, Evan W. Newell, Tao Cheng, Florent Ginhoux, Lai Guan Ng Immunity
1 Jun 2019 SERC Institute of Microelectronics Over 10% of k2eff Demonstrated by 2-GHz Spurious Mode-Free Sc0.12Al0.88N Laterally Coupled Alternating Thickness Mode Resonators Nan Wang, Yao Zhu, Geng Li Chua, Bangtao Chen, Srinivas Merugu, Navab Singh, Yuandong Gu IEEE Electron Device Letters
30 Aug 2017 SERC Institute for Infocomm Research Superpixel Guided Deep-Sparse-Representation Learning For Hyperspectral Image Classification Jiayuan FAN, Tao CHEN, Shijian LU IEEE Transactions on Circuits and Systems for Video Technology
8 Feb 2015 SERC Institute for Infocomm Research Scene text extraction based on edges and support vector regression Shijian LU, Tao CHEN, Shangxuan Tian, Joo-Hwee Lim, Chew-Lim Tan International Journal on Document Analysis and Recognition (IJDAR)
1 Apr 2014 SERC Institute for Infocomm Research Discriminative Soft Bag-of-Visual Phrase for Mobile Landmark Recognition Tao CHEN, Kim-Hui Yap, Dajiang Zhang IEEE Transactions on Multimedia
1 Sep 2013 SERC Institute of Microelectronics Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices Jaibir Sharma, Cheng Jin, Ying Ying Lim, Justin See Toh, Sanchitha Fernando, Bangtao Chen, Vasarla Nagendra Sekhar IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Sep 2013 SERC Institute of Microelectronics Antenna-in-Package Design Based on Wafer-Level Packaging With Through Silicon Via Technology Cheng Jin, V.N Sekhar, Xiaoyue Bao, Bangtao Chen, Boyu Zheng, Rui Li IEEE Transactions on Components, Packaging and Manufacturing Technology