Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
18 Mar 2024 | SERC | Institute of Microelectronics | Characterization of FOWLP Antenna in Packages | Sun Mei, Lim Teck Guan, Zhou Lin | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
29 Aug 2023 | SERC | Institute of Microelectronics | Optimization of 60 GHz three-port Grid Array Antenna | Zhao Wei, Sun Mei, Guo Yongxin | 2023 IEEE MTT-S International Wireless Symposium (IWS) |
5 Jan 2022 | SERC | Institute of Microelectronics | Dual Polarized FOWLP AiP for 5G Base Station Applications | Sun Mei, Lim Teck Guan | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
10 Dec 2019 | SERC | Institute for Infocomm Research | Enhanced Gain-Flatness of Planar Log-Periodic Dipole Array Antenna Loaded with Metasurface | Guohua Zhai, Sun Mei, Nasimuddin, Bo Shi | 2019 IEEE Asia-Pacific Microwave Conference (APMC) |