| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 19 Sep 2024 | SERC | Institute of High Performance Computing | Effect of geometry and adhesion on the performance of fiber reinforced thermoplastic composite joints with metal inserts | Muhammad Ridha, Zhoucheng Su, Le Quan Ngoc Tran, Wei Ming Albert Yek, Sridhar Narayanaswamy, Tong-Earn Tay | Composites Part A: Applied Science and Manufacturing |
| 6 Jun 2019 | SERC | Institute of High Performance Computing | Electroplating of Through Silicon Vias: A Kinetic Monte Carlo Model | MingRui Lai, Ramanarayan Hariharaputran, Khoong Hong Khoo, Hongmei Jin, Shunnian Wu, Chaitanya Amol Joshi, Kodanda Ram Mangipudi, Siu Sin Quek, David T. Wu, Sridhar Narayanaswamy, Bharathi Madurai Srinivasan | 2019 Electron Devices Technology and Manufacturing Conference (EDTM) |