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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 Others Institute of Microelectronics SAW Cavity Sealing using Dielectric film in Wafer-level packaging Chockanathan Vinoth Kanna, Soon Wee Ho 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 Others Institute of Microelectronics Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Jiaqi Wu, Rathin Mandal, Nanxi Li, Teck Guan Lim, Jason Tsung-Yang Liow, Surya Bhattacharya 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 Others Institute of Microelectronics Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 Others Institute of Microelectronics High Density Redistribution Layers (< 2 µm L/S) for Chiplets Packaging Soon Wee Ho, Chockanathan Vinoth Kanna, Jong Ming Chinq, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 Others Institute of Microelectronics Low Temperature Oxide Passivation for Via-last/backside process Serine Soh Siew Boon, Soon Wee Ho, Wang Zong Bin, Chia Ching Keat 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 Others Institute of Microelectronics Fine Pitch Line/Space Lithography for Large Area Package with Multi-Field Stitching Soon Wee Ho, Norman Yen, Cliff McCold, Robert Hsieh, Ha-Ai Nguyen, Hank Hsu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017 Others Institute of Microelectronics Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package Zhaohui Chen, Faxing Che, Mian Zhi Ding, David Soon Wee Ho, Tai Chong Chai, Vempati Srinivasa 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 Others Institute of Microelectronics Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging Yew Wing Leong, Hsiang-Yao Hsiao, David Soon Wee Ho, Boon Long Lau, Huamao Lin 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Aug 2015 Others Institute of Microelectronics Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya IEEE Design & Test
1 Sep 2013 Others Institute of Microelectronics Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration Cheng Jin, Siong Chiew Ong, Teck Guan Lim, Ka Fai Chang, Soon Wee Ho IEEE Transactions on Components, Packaging and Manufacturing Technology