Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
18 Mar 2024 | SERC | Institute of Microelectronics | Through Mold Vertical Interconnect Formation in FOWLP using conductive paste | Serine Soh Siew Boon, Soon Wee David Ho, Norhanani Jaafar | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |