| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Sep 2013 | SERC | Institute of Microelectronics | Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration | Cheng Jin, Siong Chiew Ong, Teck Guan Lim, Ka Fai Chang, Soon Wee Ho | IEEE Transactions on Components, Packaging and Manufacturing Technology |