| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Development of Large RDL Interposer Package using RDL-first FOWLP Process (Pending publish) | Soon Wee Ho, Siew Boon Soh, Boon Long Lau, Hsiao Hsiang-Yao, Vempati Srinivasa Rao | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |