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Publication date Communities Collections Article title Author(s) Journal/Conference
10 Aug 2021 SERC Institute of Microelectronics Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio Ser Choong Chong, Simon Siak Boon Lim, Wen Wei Seit, Tai Chong Chai, Debbie Claire Sanchez 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)