| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 3 Aug 2023 | SERC | Institute of Microelectronics | Design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Minituarization | Mihai Dragos Rotaru, Shashank Tiwari, Paul Castillou, Chai Tai Chong, Chui King Jien | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |