| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | AiP Component and Board Level Heat dissipation Analysis for Automotive Radar | Yong Han, Tai Chong Chai, Sharon Seow Huang Lim | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |