| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Through Mold Vertical Interconnect Formation in FOWLP using conductive paste | Serine Soh Siew Boon, Soon Wee David Ho, Norhanani Jaafar | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| 5 Jan 2022 | SERC | Institute of Microelectronics | Low Temperature Oxide Passivation for Via-last/backside process | Serine Soh Siew Boon, Soon Wee Ho, Wang Zong Bin, Chia Ching Keat | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| 5 Jan 2022 | SERC | Institute of Microelectronics | Low Temperature Physical Vapour Deposited Cu Seed Layer for Temporary Bonded Wafer Substrates | Abdul Hannan Yeo, Serine Soh Siew Boon, David Ho Soon Wee, Kalyn Lim Tien Shee, Wei Jun Qi, Zhang Kang, Kelvin Boh Tai Ming, Cheng Ting | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |