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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Through Mold Vertical Interconnect Formation in FOWLP using conductive paste Serine Soh Siew Boon, Soon Wee David Ho, Norhanani Jaafar 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Low Temperature Oxide Passivation for Via-last/backside process Serine Soh Siew Boon, Soon Wee Ho, Wang Zong Bin, Chia Ching Keat 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Low Temperature Physical Vapour Deposited Cu Seed Layer for Temporary Bonded Wafer Substrates Abdul Hannan Yeo, Serine Soh Siew Boon, David Ho Soon Wee, Kalyn Lim Tien Shee, Wei Jun Qi, Zhang Kang, Kelvin Boh Tai Ming, Cheng Ting 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
30 May 2017 SERC Institute of Microelectronics Thin-film Magnetic Inductors for Integrated Power Management Jun Yu, Serine Soh, Muthukumaraswamy Annamalai Arasu, King Jien Chui, Wei Yi Lim, Sunil Wickramanayaka, Yew Wing Leong, Huamao Lin 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)