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Publication date Communities Collections Article title Author(s) Journal/Conference
9 Mar 2023 SERC Institute for Infocomm Research Specialty optical fibers for advanced sensing applications Huanhuan Liu, Dora Juan Juan Hu, Qizhen Sun, Lei Wei, Kaiwei Li, Changrui Liao, Bozhe Li, Cong Zhao, Xinyong Dong, Yuhan Tang, Yihong Xiao, Gerd Keiser, Perry Ping Shum Opto-Electronic Science
23 Nov 2022 SERC Institute of Materials Research and Engineering A Paradigm of Calendaring‐Driven Electrode Microstructure for Balanced Battery Energy Density and Power Density Renming Zhan, Dongsheng Ren, Shiyu Liu, Zhengxu Chen, Xuerui Liu, Wenyu Wang, Lin Fu, Xiancheng Wang, Shuibin Tu, Yangtao Ou, Hanlong Ge, Andrew Jun Yao Wong, Zhi Wei Seh, Li Wang, Yongming Sun Advanced Energy Materials
11 Aug 2022 SERC Institute of Materials Research and Engineering Nanocomposite of Conducting Polymer and Li Metal for Rechargeable High Energy Density Batteries Lingyue Wang, Xiancheng Wang, Renming Zhan, Zhengxu Chen, Shuibin Tu, Chunhao Li, Xuerui Liu, Zhi Wei Seh, Yongming Sun ACS Applied Materials & Interfaces
8 Apr 2022 BMRC Institute of Bioengineering and Bioimaging Cardio‐respiratory and phenotypic rescue of dystrophin/utrophin‐deficient mice by combination therapy Caorui Lin, Gang Han, Lulu Jia, Yiwen Zhao, Jun Song, Ning Ran, Toshifumi Yokota, Yiqi Seow, HaiFang Yin EMBO reports
13 May 2016 BMRC Bioinformatics Institute Branched Peptide, B2088, Disrupts the Supramolecular Organization of Lipopolysaccharides and Sensitizes the Gram-negative Bacteria Rajamani Lakshminarayanan, Wei Xiang Tan, Thet Tun Aung, Eunice Tze Leng Goh, Nandhakumar Muruganantham, Jianguo Li, Jamie Ya Ting Chang, Neha Dikshit, Padmanabhan Saraswathi, Rayne Rui Lim, Tse Siang Kang, Vanniarajan Balamuralidhar, Bindu Sukumaran, Chandra S. Verma, Jayaraman Sivaraman, Shyam Sunder Chaurasia, Shouping Liu, Roger W. Beuerman Scientific Reports
1 Sep 2013 SERC Institute of Microelectronics Antenna-in-Package Design Based on Wafer-Level Packaging With Through Silicon Via Technology Cheng Jin, V.N Sekhar, Xiaoyue Bao, Bangtao Chen, Boyu Zheng, Rui Li IEEE Transactions on Components, Packaging and Manufacturing Technology