Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
15 Feb 2016 SERC Institute of Microelectronics An Analytical Capacitance Model for Through Silicon Vias (TSVs) in Floating Silicon Substrate Ka Fai Chang, Jun Zhou, Surya Bhattacharya, Roshan Weerasekera, Guruprasad Katti, Rahul Dutta, Songbai Zhang IEEE TRANSACTION ON ELECTRON DEVICES
1 Aug 2015 SERC Institute of Microelectronics Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya IEEE Design & Test
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews
8 Oct 2014 SERC Institute of Microelectronics BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems Minkyu Je, Xin Liu, Philippe Royannez, Jun Zhou, Roshan Weerasekera, Bin Zhao, Chao Wang IEEE Transactions on Circuits and Systems I: Regular Papers