Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging (Pending publish) Yong Chyn Ng, Hongyu Li, Norhanani Binte Jaafar, Rainer Cheow Siong Lee, Ding Huang, Chit Siong Lau, Kuan Eng Johnson Goh, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
4 Oct 2021 SERC Institute of Microelectronics 3D Cryogenic Interposer for Quantum Computing Application Hongyu Li, Chit Siong Aaron Lau, Norhanani Jaafar, Rainer Cheow Siong Lee, Calvin Pei Yu Wong, Kuan Eng Johnson Goh, King-Jien Chui 2022 IEEE 72nd Electronic Components and Technology Conference