Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
18 Mar 2024 | SERC | Institute of Microelectronics | Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging (Pending publish) | Yong Chyn Ng, Hongyu Li, Norhanani Binte Jaafar, Rainer Cheow Siong Lee, Ding Huang, Chit Siong Lau, Kuan Eng Johnson Goh, King-Jien Chui | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
4 Oct 2021 | SERC | Institute of Microelectronics | 3D Cryogenic Interposer for Quantum Computing Application | Hongyu Li, Chit Siong Aaron Lau, Norhanani Jaafar, Rainer Cheow Siong Lee, Calvin Pei Yu Wong, Kuan Eng Johnson Goh, King-Jien Chui | 2022 IEEE 72nd Electronic Components and Technology Conference |