| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 4 Oct 2021 | SERC | Institute of Microelectronics | 3D Cryogenic Interposer for Quantum Computing Application | Hongyu Li, Chit Siong Aaron Lau, Norhanani Jaafar, Rainer Cheow Siong Lee, Calvin Pei Yu Wong, Kuan Eng Johnson Goh, King-Jien Chui | 2022 IEEE 72nd Electronic Components and Technology Conference |