| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Oct 2016 | SERC | Institute of Microelectronics | 3-D Modeling and Characterization for Die Attach Process | Siow Ling Ho, Min Woo Rhee, Puay Fen Yong, Bu Lin, Leong Ching Wai | IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY |