Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
5 Jan 2022 | SERC | Institute of Microelectronics | Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform | Tc Chai, David Ho, Sc Chong, Ps Sharon Lim, Hy Hsiao, Jacob Soh | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |