Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform Tc Chai, David Ho, Sc Chong, Ps Sharon Lim, Hy Hsiao, Jacob Soh 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)