| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | Dielectric Materials Characterization for Hybrid Bonding | Vivek Chidambaram, Prayudi Lianto, Xiangyu Wang, Gilbert See, Nicholas Wiswell, Masaya Kawano | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |