| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Aug 2013 | SERC | Institute of Microelectronics | Development of Package-on-Package Using Embedded Wafer-Level Package Approach (Pending publish) | Ser Choong Chong, David Ho Soon Wee, Vempati Srinivasa Rao, Nagendra Sekhar Vasarla | IEEE Transactions on Components, Packaging and Manufacturing Technology |