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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Aug 2021 SERC Institute of Microelectronics Sampling sub-THz phase noise in frequency microcombs via fiber interferometry Wenting Wang, Xinghe Jiang, Abhinav Kumar Vinod, Xinzhou Su, Jinghui Yang, Mingbin Yu, Dim-Lee Kwong, Chee Wei Wong Conference on Lasers and Electro-Optics
17 Aug 2021 SERC Institute of Microelectronics High spectral purity chip-scale tunable THz radiation source Wenting Wang, Ping-Keng Lu, Abhinav Kumar Vinod, James McMillan, Mingbin Yu, Dim-Lee Kwong, Mona Jarrahi, Chee Wei Wong Conference on Lasers and Electro-Optics
17 Aug 2021 SERC Institute of Microelectronics Real-time observation of breathing soliton and soliton molecules dynamics in strong coupled microcavity Wenting Wang, Xinghe Jiang, Abhinav Kumar Vinod, Hao Liu, Mingbin Yu, Dim-Lee Kwong, Chee Wei Wong Conference on Lasers and Electro-Optics
17 Aug 2021 SERC Institute of Microelectronics Nanometric precision metrology based on hybrid spectrally resolved and homodyne interferometry via a single soliton microcomb Hao Liu, Yoon-Soo Jang, Jinghui Yang, Mingbin Yu, Dim-Lee Kwong, Chee Wei Wong Conference on Lasers and Electro-Optics
17 Aug 2021 SERC Institute of Microelectronics Quantum State Tomography of an On-chip Polarization-Spatial Qubit SWAP Gate Xiang Cheng, Zhenda Xie, Kai-Chi Chang, Murat Can Sarihan, Yoo Seung Lee, Abhinav Kumar Vinod, Yongnan Li, XinAn Xu, Serdar Kocaman, Mingbin Yu, Dim-Lee Kwong, Jeffrey H. Shapiro, Franco N. C. Wong, Chee Wei Wong Conference on Lasers and Electro-Optics
24 Sep 2020 SERC Institute of Materials Research and Engineering Low loss waveguiding and slow light modes in coupled subwavelength silicon Mie resonators Lu ding, Ye Feng Yu, Dmitry Morits, Mingbin Yu, Thomas Y. L. Ang, Hong-Son Chu, Soon Thor Lim, Ching Eng Png, Ramón Paniagua-Domínguez, Arseniy I. Kuznetsov Nanoscale
30 May 2017 SERC Institute of Microelectronics Electrical Characterization of CMP-less Via-Last TSV under Reliability Stress Conditions King-Jien Chui, Mingbin Yu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu, King-Jien Chui 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Passive Devices Fabrication on FOWLP and Characterization for RF Applications Chunmei Wang, King Jien Chui, Xiangyu Wang, Teck Guan Lim, Mingbin Yu, Gilbert See, Gu Yu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics High-band AlN Based RF-MEMS Resonator for TSV integration Srinivas Merugu, Mingbin Yu, Gengli Chua, Nan Wang, Yao Zhu, Chengliang Sun 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)