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Publication date Communities Collections Article title Author(s) Journal/Conference
1 Jan 2017 SERC Institute of Microelectronics Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Jan 2017 SERC Institute of Microelectronics 3-D TSV Six-Die Stacking and Reliability Assessment of 20-μm-Pitch Bumps on Large-Scale Die Jong Bum Lee, Jie Li Aw, Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Oct 2016 SERC Institute of Microelectronics 3-D Modeling and Characterization for Die Attach Process Siow Ling Ho, Min Woo Rhee, Puay Fen Yong, Bu Lin, Leong Ching Wai IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
7 Apr 2016 SERC Institute of Microelectronics Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices Gongyue Tang, Boon Long Lau, Xiaowu Zhang, Daniel Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology