| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Sep 2018 | SERC | Institute of Microelectronics | Cost-Effective Testing Solutions for Sealing Material with IR Package | Bu Lin, Jason Keng Yuen Au, Mian Zhi Ding, Vivek Chidambaram, Foo Wing Ng | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 1 Nov 2017 | SERC | Institute of Microelectronics | Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling | Mian Zhi Ding, Yong Han, Surya Bhattacharya, Fa Xing Che, Masaya Kawano | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 30 May 2017 | SERC | Institute of Microelectronics | Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package | Zhaohui Chen, Faxing Che, Mian Zhi Ding, David Soon Wee Ho, Tai Chong Chai, Vempati Srinivasa | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |