Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
30 May 2017 | SERC | Institute of Microelectronics | Co-design for Low Warpage and High Reliability in Advanced Package yvith TSVFree Interposer (TFI) | S. Bhattacharya, F.X. Che, M.Z. Ding, Y. Han | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |