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Publication date Communities Collections Article title Author(s) Journal/Conference
31 Mar 2014 Others Institute of Microelectronics Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers Heng Yun Zhang, Xiao Wu Zhang, B. L. Lau, Sharon Lim, Liang Ding, M. B. Yu IEEE Transactions on Components, Packaging and Manufacturing Technology