| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 31 Mar 2014 | SERC | Institute of Microelectronics | Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers | Heng Yun Zhang, Xiao Wu Zhang, B. L. Lau, Sharon Lim, Liang Ding, M. B. Yu | IEEE Transactions on Components, Packaging and Manufacturing Technology |