| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding | Qingxin Zhang, Yuandong Gu, Nan Wang, Li Yan Siow, Lionel You Liang Wong, Chengliang Sun, Hongmiao Ji, Darmayuda I Made, Peter Chang | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |