| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 19 Jul 2019 | SERC | Institute of Microelectronics | Hermetic Sealant Material Possibilities for IR Sensor Packaging | Vivek Chidambaram, Lin Bu, Kai Liang Chuan | Journal of Electronic Materials |
| 1 Oct 2013 | SERC | Institute of Microelectronics | Investigation on Die Shift Issues in the 12-in Wafer-Level Compression Molding Process | Lin Bu, Siowling Ho, Sorono Dexter Velez, Taichong Chai, Xiaowu Zhang | IEEE Transactions on Components, Packaging and Manufacturing Technology |