| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 23 Jun 2015 | SERC | Institute of Microelectronics | Heterogeneous 2.5D integration on through silicon interposer | Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong | Applied Physics Reviews |
| 31 Mar 2014 | SERC | Institute of Microelectronics | Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers | Heng Yun Zhang, Xiao Wu Zhang, B. L. Lau, Sharon Lim, Liang Ding, M. B. Yu | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 27 Apr 2012 | SERC | Institute of Microelectronics | 310 GHz gain-bandwidth product Ge/Si avalanche photodetector for 1550 nm light detection | Liang Ding, G. Q. Lo, Andy Eu-Jin Lim, Ning Duan, Tsung-Yang Liow | Optics Express |