| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module | Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |