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Publication date Communities Collections Article title Author(s) Journal/Conference
15 Feb 2016 SERC Institute of Microelectronics An Analytical Capacitance Model for Through Silicon Vias (TSVs) in Floating Silicon Substrate Ka Fai Chang, Jun Zhou, Surya Bhattacharya, Roshan Weerasekera, Guruprasad Katti, Rahul Dutta, Songbai Zhang IEEE TRANSACTION ON ELECTRON DEVICES
1 Aug 2015 SERC Institute of Microelectronics Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya IEEE Design & Test
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews
1 Sep 2013 SERC Institute of Microelectronics Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration Cheng Jin, Siong Chiew Ong, Teck Guan Lim, Ka Fai Chang, Soon Wee Ho IEEE Transactions on Components, Packaging and Manufacturing Technology