Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
1 Aug 2015 | SERC | Institute of Microelectronics | Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) | Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya | IEEE Design & Test |