| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Jan 2017 | SERC | Institute of Microelectronics | 3-D TSV Six-Die Stacking and Reliability Assessment of 20-μm-Pitch Bumps on Large-Scale Die | Jong Bum Lee, Jie Li Aw, Min Woo Rhee | IEEE Transactions on Components, Packaging and Manufacturing Technology |