| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 3 Aug 2023 | SERC | Institute of Microelectronics | 3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer | Chai Tai Chong, Lau Boon Long, Sharon Lim Pei Siang, David Ho Soon Wee, Rob van Kampen, Paul Castillou, Roberto Gaddi, Lance Barron, Mickael Renault, Jay Ko, Jonathan Hammond | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |