| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package | Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| 30 May 2017 | SERC | Institute of Microelectronics | Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging | Yew Wing Leong, Hsiang-Yao Hsiao, David Soon Wee Ho, Boon Long Lau, Huamao Lin | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| 1 Mar 2015 | SERC | Institute of Microelectronics | Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing | Tai Chong Chai, Hsiang-Yao Hsiao, Alastair David Trigg | IEEE Transactions on Components, Packaging and Manufacturing Technology |