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5 Jan 2022
SERC
Institute of Microelectronics
Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding
Hongmiao Ji,
King-Jien Chui
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
30 May 2017
SERC
Institute of Microelectronics
Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding
Qingxin Zhang,
Yuandong Gu,
Nan Wang,
Li Yan Siow,
Lionel You Liang Wong,
Chengliang Sun,
Hongmiao Ji,
Darmayuda I Made,
Peter Chang
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017
SERC
Institute of Microelectronics
High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors
Jinghui Xu,
Zhipeng Ding,
Vivek Chidambaram,
Hongmiao Ji,
Yuandong Gu
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Feb 2014
SERC
Institute of Microelectronics
A Miniaturization Strategy for Harvesting Vibration Energy Utilizing Helmholtz Resonance and Vortex Shedding Effect
Qingxin Zhang,
Yuandong Gu,
Dim-Lee Kwong,
Chengliang Sun,
Xiaojing Mu,
Li Yan Siow,
Wei Mong Tsang,
Hongmiao Ji,
Hyun Kee Chang
IEEE Electron Device Letters
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