Search results

Publication date	Communities	Collections	Article title	Author(s)	Journal/Conference
30 May 2017	SERC	Institute of Microelectronics	Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding	Qingxin Zhang, Yuandong Gu, Nan Wang, Li Yan Siow, Lionel You Liang Wong, Chengliang Sun, Hongmiao Ji, Darmayuda I Made, Peter Chang	2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017	SERC	Institute of Microelectronics	High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors	Jinghui Xu, Zhipeng Ding, Vivek Chidambaram, Hongmiao Ji, Yuandong Gu	2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Feb 2014	SERC	Institute of Microelectronics	A Miniaturization Strategy for Harvesting Vibration Energy Utilizing Helmholtz Resonance and Vortex Shedding Effect	Qingxin Zhang, Yuandong Gu, Dim-Lee Kwong, Chengliang Sun, Xiaojing Mu, Li Yan Siow, Wei Mong Tsang, Hongmiao Ji, Hyun Kee Chang	IEEE Electron Device Letters