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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding Hongmiao Ji, King-Jien Chui 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
30 May 2017 SERC Institute of Microelectronics Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding Qingxin Zhang, Yuandong Gu, Nan Wang, Li Yan Siow, Lionel You Liang Wong, Chengliang Sun, Hongmiao Ji, Darmayuda I Made, Peter Chang 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors Jinghui Xu, Zhipeng Ding, Vivek Chidambaram, Hongmiao Ji, Yuandong Gu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Feb 2014 SERC Institute of Microelectronics A Miniaturization Strategy for Harvesting Vibration Energy Utilizing Helmholtz Resonance and Vortex Shedding Effect Qingxin Zhang, Yuandong Gu, Dim-Lee Kwong, Chengliang Sun, Xiaojing Mu, Li Yan Siow, Wei Mong Tsang, Hongmiao Ji, Hyun Kee Chang IEEE Electron Device Letters