Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding Hongmiao Ji, King-Jien Chui 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
30 May 2017 SERC Institute of Microelectronics High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors Jinghui Xu, Zhipeng Ding, Vivek Chidambaram, Hongmiao Ji, Yuandong Gu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding Qingxin Zhang, Yuandong Gu, Nan Wang, Li Yan Siow, Lionel You Liang Wong, Chengliang Sun, Hongmiao Ji, Darmayuda I Made, Peter Chang 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Feb 2014 SERC Institute of Microelectronics A Miniaturization Strategy for Harvesting Vibration Energy Utilizing Helmholtz Resonance and Vortex Shedding Effect Qingxin Zhang, Yuandong Gu, Dim-Lee Kwong, Chengliang Sun, Xiaojing Mu, Li Yan Siow, Wei Mong Tsang, Hongmiao Ji, Hyun Kee Chang IEEE Electron Device Letters