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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Heating Dissipation Discussion of TSV-integrated Ion Trap with Glass Interposer Peng Zhao, Xin Wen Bi, Hong Yu Li, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
20 Sep 2021 SERC Institute of Microelectronics RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing Peng Zhao, Hong Yu Li, Jing Tao, Jean-Pierre Likforman, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan IEEE Transactions on Components, Packaging and Manufacturing Technology
17 Aug 2021 SERC Institute of Microelectronics Design and Fabrication of Silicon Gratings for the Optical Addressing of Trapped Ion Qubits Yu Dian Lim, Hong Yu Li, Peng Zhao, Jing Tao, Luca Guidoni, Chuan Seng Tan Conference on Lasers and Electro-Optics
7 Jul 2021 SERC Institute of Microelectronics Design and Fabrication of Grating Couplers for the Optical Addressing of Trapped Ions Yu Dian Lim, Hong Yu Li, Peng Zhao, Jing Tao, Luca Guidoni, Chuan Seng Tan IEEE Photonics Journal
1 May 2021 SERC Institute of Microelectronics Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer Jing Tao, Jean-Pierre Likforman, Peng Zhao, Hong Yu Li, Theo Henner, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan physica status solidi (b)
19 Mar 2021 SERC Institute of Microelectronics Structural Integrity of 3-D Metal–Insulator–Metal Capacitor Embedded in Fully Filled Cu Through-Silicon via Ye Lin, Hong Yu Li, Chuan Seng Tan IEEE Transactions on Components, Packaging and Manufacturing Technology
21 Dec 2020 BMRC Institute of Molecular and Cell Biology Remodelling of whole-body lipid metabolism and a diabetic-like phenotype caused by loss of CDK1 and hepatocyte division Jin Rong Ow, Matias J Caldez, Gözde Zafer, Juat Chin Foo, Hong Yu Li, Soumita Ghosh, Heike Wollmann, Amaury Cazenave-Gassiot, Chee Bing Ong, Markus R Wenk, Weiping Han, Hyungwon Choi, Philipp Kaldis eLife
1 Aug 2015 SERC Institute of Microelectronics Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya IEEE Design & Test
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews
1 Nov 2013 SERC Institute of Microelectronics Relationship Between Wafer-Level Warpage and Cu Overburden Thickness Controlled by Isotropic Wet Etching for Through Si Vias Steven Lee Hou Jang, Ramana Murthy, Eugene Tan Swee Kiat, Jae Woong Choi, Lee Guan Ong, Hong Yu Li, Soon Wook Kim, Gil Ho Hwang IEEE Transactions on Components, Packaging and Manufacturing Technology