| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Wafer-to-Wafer Hybrid Bonding Challenges for 3D IC Applications | H. Y. Li, Hong Miao Ji, Alfred Neo Siang Kiat, Masaya Kawano | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |