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Publication date Communities Collections Article title Author(s) Journal/Conference
30 May 2023 SERC Institute of Materials Research and Engineering Sub-10 nm Mixing and Alloying of Cu–Ag and Cu–Ni via Accelerated Solid Diffusion Haiwen Dai, Sofia Dimitriadou, P. S. Sankara Rama Krishnan, Albertus Denny Handoko, Jose Recatala-Gomez, Yong Wang, D. V. Maheswar Repaka, Maung Thway, Chenguang Zhang, Martial Duchamp, Kedar Hippalgaonkar ACS Applied Materials & Interfaces
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans Ramanpreet Singh Pahwa, Saisubramaniam Gopalakrishnan, Huang Su, Ong Ee Ping, Haiwen Dai, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning Ramanpreet Singh Pahwa, Ma Tin Lay Nwe, Richard Chang, Oo Zaw Min, Wang Jie, Saisubramaniam Gopalakrishnan, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao, Haiwen Dai, Jens Timo Neumann, Ramani Pichumani, Tom Gregorich 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)