| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | Dielectric Materials Characterization for Hybrid Bonding | Vivek Chidambaram, Prayudi Lianto, Xiangyu Wang, Gilbert See, Nicholas Wiswell, Masaya Kawano | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| 30 May 2017 | SERC | Institute of Microelectronics | Passive Devices Fabrication on FOWLP and Characterization for RF Applications | Chunmei Wang, King Jien Chui, Xiangyu Wang, Teck Guan Lim, Mingbin Yu, Gilbert See, Gu Yu | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |