| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Sep 2018 | SERC | Institute of Microelectronics | Cost-Effective Testing Solutions for Sealing Material with IR Package | Bu Lin, Jason Keng Yuen Au, Mian Zhi Ding, Vivek Chidambaram, Foo Wing Ng | IEEE Transactions on Components, Packaging and Manufacturing Technology |