Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
30 May 2017 | SERC | Institute of Microelectronics | Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package | Zhaohui Chen, Faxing Che, Mian Zhi Ding, David Soon Wee Ho, Tai Chong Chai, Vempati Srinivasa | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |