| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Nov 2017 | SERC | Institute of Microelectronics | Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling | Mian Zhi Ding, Yong Han, Surya Bhattacharya, Fa Xing Che, Masaya Kawano | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 18 Jan 2016 | SERC | Institute of Microelectronics | Design Optimization and Characterization of Silicon Microcooler System through Finite Element Modeling and Experimental Analyses | Fa Xing Che, Yong Han, Boon Long Lau, Xiaowu Zhang | IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY |
| 17 Dec 2014 | SERC | Institute of Microelectronics | Characterization and Modeling of Fine-Pitch Copper Ball 4 Bonding on a Cu/Low-k Chip | Xiaowu Zhang, T. C. Chai, Fa Xing Che, L. C. Wai | Journal of Electronic Materials |