| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package | Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |